Unisoc Tanggula T770

The Unisoc Tanggula T770 is a high-performance SoC designed to deliver robust performance and advanced features for smartphones and tablets. Announced in 2021, it is built using a 6-nanometer process technology, ensuring excellent power efficiency and strong performance for a wide range of mobile applications.

The Tanggula T770 features an octa-core CPU configuration with two high-performance ARM Cortex-A76 cores clocked at up to 2.5 GHz and six power-efficient ARM Cortex-A55 cores running at up to 2.0 GHz. This setup provides robust performance for demanding tasks while maintaining energy efficiency for everyday activities and multitasking.

For graphics, the Tanggula T770 integrates the ARM Mali-G57 GPU, delivering solid performance for gaming and high-definition multimedia applications. The GPU supports advanced graphics APIs and ensures smooth, high-frame-rate visuals, enhancing the overall user experience.

A standout feature of the Tanggula T770 is its advanced AI Processing Unit (APU), which significantly enhances AI-driven applications such as real-time image processing, facial recognition, and augmented reality. This AI engine improves the overall responsiveness and intelligence of the device, enabling advanced AI features and better user experiences.

SPECIFICATIONS