The MediaTek Dimensity 8050 is a robust 8-core SoC that was unveiled on May 9, 2023. Crafted using advanced 6-nanometer process technology, it offers an optimal blend of power and efficiency. The chipset features a high-performance Cortex-A78 core running at 3000 MHz, supplemented by three additional Cortex-A78 cores at 2600 MHz, and four Cortex-A55 cores…
The MediaTek Dimensity 7050 is a mid-range SoC designed to deliver strong performance and advanced features for smartphones and tablets. Announced in 2023, it is built using a 6-nanometer process technology, ensuring excellent power efficiency and robust performance for a variety of mobile applications. The Dimensity 7050 features an octa-core CPU configuration with a combination…
Snapdragon 6 Gen 2 is the upcoming SoC from Qualcomm and the successor to Snapdragon 6 Gen 1. While the release date is not finalized, it is rumored to be released in the last quarter of 2024. This upcoming chipset promises to bring significant enhancements to the mid-range smartphone market. It will most probably be…
The MediaTek Dimensity 6080 is a mid-range SoC designed to deliver strong performance and advanced features for smartphones and tablets. Announced in 2023, it is built using a 6-nanometer process technology, ensuring excellent power efficiency and robust performance for various mobile applications. The Dimensity 6080 features an octa-core CPU configuration with a combination of two…
The MediaTek Dimensity 7020 is an impressive 8-core SoC with Antutu score of 471522. It’s built using advanced 6-nanometer process technology, ensuring both power and efficiency. The SoC is equipped with 2 high-performance Cortex-A78 cores clocked at 2200 MHz, alongside 6 Cortex-A55 cores running at 2000 MHz, offering a balanced blend of speed and energy…
Apple is expected to introduce its next-generation chip A18 Pro (A18 Bionic) for the iPhone 16 Pro and Pro Max. These chips are planned to be manufactured using TSMC’s advanced second-generation “N3E” 3nm process. The current N3 process, serving as a preliminary version of the 3nm technology, faces high production costs and limited yields. The…