MediaTek Dimensity 930

The MediaTek Dimensity 930 is a powerful 8-core chipset unveiled on May 23, 2022. Designed for high-performance smartphones, it is built using an advanced 6-nanometer process technology, ensuring a balance of power efficiency and robust performance.

This SoC features a dual-cluster architecture with two high-performance ARM Cortex-A78 cores clocked at 2.2 GHz, and six power-efficient ARM Cortex-A55 cores running at 2.0 GHz. This configuration delivers a seamless multitasking experience and efficient handling of demanding applications.

The Dimensity 930 is equipped with an IMG BXM-8-256 GPU, providing excellent graphics performance suitable for gaming and high-definition multimedia tasks. The chipset also supports advanced AI capabilities, enhancing camera functionalities and other smart features.

In terms of connectivity, the Dimensity 930 integrates a 5G modem with support for both sub-6GHz and mmWave frequencies, ensuring fast and reliable mobile internet speeds. It also supports the latest Wi-Fi 6 and Bluetooth 5.2 standards, providing improved wireless connectivity.

The chipset includes an advanced ISP (Image Signal Processor) that supports up to 108MP cameras, enabling high-quality photography and advanced imaging features such as multi-frame noise reduction and AI-based enhancements. Additionally, it supports 4K video recording at 30fps, ensuring superior video quality.

Memory compatibility for the Dimensity 930 includes LPDDR4x RAM, ensuring fast data access and smooth performance. The SoC also features UFS 3.1 storage support, providing quick read and write speeds for enhanced overall device performance.

SPECIFICATIONS