MediaTek Dimensity 8250

The MediaTek Dimensity 8250 is a refreshed mid-range SoC designed to deliver robust performance and advanced features for smartphones and tablets. Announced in 2023, it is an update of the Dimensity 8200 chipset from late 2022. Both the Dimensity 8200 and 8250 are built using a 4-nanometer process technology from TSMC (N4), ensuring superior power efficiency and strong performance for a variety of mobile applications.

The Dimensity 8250 features an octa-core CPU configuration with a combination of four high-performance ARM Cortex-A78 cores (one clocked at up to 3.1 GHz and the other three at up to 3.0 GHz) and four power-efficient ARM Cortex-A55 cores running at up to 2.0 GHz. This setup provides exceptional performance for demanding tasks while maintaining energy efficiency for everyday activities and multitasking.

For graphics, the Dimensity 8250 integrates the ARM Mali-G610 MC6 GPU, delivering impressive performance for gaming and high-definition multimedia applications. The GPU supports advanced graphics APIs and high frame rates, ensuring a smooth and immersive visual experience.

The chipset supports quad-channel LPDDR5 RAM (up to 6,400 Mbps) and UFS 3.1 storage, ensuring fast data access and efficient multitasking capabilities. This combination contributes to overall system responsiveness and performance.

In terms of connectivity, the Dimensity 8250 includes an integrated 5G modem, supporting sub-6 GHz 5G networks with download speeds of up to 4.7 Gbps. This ensures ultra-fast and reliable mobile internet connectivity. Additionally, the chipset supports three-band Wi-Fi 6E, Bluetooth 5.3 with Bluetooth LE Audio, and various positioning systems, providing versatile and reliable wireless connectivity options.

Imaging capabilities are advanced with the Dimensity 8250’s ISP, supporting HDR processing in 14-bits and handling sensors up to 320MP or three 32MP cameras simultaneously. The chipset enables 2x lossless zoom when paired with a high-resolution main sensor. It also supports 4K video recording at up to 60fps and built-in AV1 decoding at up to 4K, making it well-suited for high-quality photo and video capture.

The display driver supports up to FHD+ displays at 180Hz or QHD+ displays at 120Hz, ensuring a high-quality visual experience. Additionally, the chipset includes features such as HDR10+ Adaptive and SDR-to-HDR conversion with AI, which also enhances noise reduction for videos.

AI capabilities are significantly enhanced with the MediaTek APU 580, which supports a wide range of AI applications. This APU is optimized to work in short bursts, keeping thermals and power usage in check while delivering high-performance AI computation.

The first device to feature the Dimensity 8250 chipset is the Oppo Reno12, set to be released on May 23, 2023. Overall, the MediaTek Dimensity 8250 combines powerful performance, advanced AI and imaging capabilities, and cutting-edge 5G connectivity, making it an excellent choice for mid-range smartphones and tablets. It provides a seamless and responsive user experience across a wide range of applications, from everyday tasks to high-end gaming and multimedia consumption.

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