MediaTek Dimensity 820

The MediaTek Dimensity 820 is a high-performance SoC designed for mid-range to high-end smartphones, released in May 2020. It is manufactured using a 7-nanometer process technology, which enhances power efficiency and performance, making it suitable for a wide range of applications, including gaming, multimedia, and everyday tasks.

The Dimensity 820 features an octa-core CPU configuration with four high-performance ARM Cortex-A76 cores clocked at up to 2.6 GHz and four power-efficient ARM Cortex-A55 cores clocked at 2.0 GHz. This arrangement ensures a balance between powerful performance for demanding tasks and energy efficiency for prolonged battery life.

For graphics, the Dimensity 820 integrates the ARM Mali-G57 MC5 GPU, which provides robust performance for gaming and graphic-intensive applications. The GPU supports advanced graphics APIs and delivers smooth visuals and efficient rendering, ensuring a high-quality gaming and multimedia experience.

One of the standout features of the Dimensity 820 is its integrated 5G modem, which supports both standalone (SA) and non-standalone (NSA) 5G networks. This ensures fast and reliable connectivity, with download speeds reaching up to 2.34 Gbps. The chipset also supports dual 5G SIM, allowing users to enjoy 5G connectivity on both SIM cards simultaneously.

The Dimensity 820 includes MediaTek’s AI Processing Unit (APU 3.0), which enhances AI-based applications and features such as facial recognition, scene detection, and real-time enhancements. This integration brings advanced AI capabilities to mid-range devices, improving their overall functionality and user experience.

SPECIFICATIONS