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Qualcomm Snapdragon 8s Gen 3 vs Unisoc Tanggula T770

We have assessed two 8-core mobile processors: Qualcomm Snapdragon 8s Gen 3 and Unisoc Tanggula T770. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 8s Gen 3
SM8650
Tanggula T770
Announced March 18, 2024 July 2021

CPU & GPU

CPU 1x Cortex-X4 @ 3.0 GHz
4x Cortex-A720 @ 2.8 GHz
3x Cortex-A520 @ 2.0 GHz
1x Cortex-A76 @ 2.5 GHz
3x Cortex-A76 @ 2.5 GHz
4x Cortex-A55 @ 2.5 GHz
GPU Adreno 700 @ 1100 MHz ARM Mali-G57
Process 4nm 6nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 108MP, 2x 24MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR4X up to 16 GB
RAM Frequency 4200 MHz 2133 MHz
Storage Type UFS 4.0 eMMC 5.1
UFS 3.1

Display

Resolution 3840 x 2160 2160 x 1080
Display Type HDR Vivid, HDR10, HDR10+ 4K
Full HD+
QHD+

AnTuTu

Score 1554839 317736

Geekbench

Single core 2019 656
Multi core 5570 2621

Network

5G Support
Modem Snapdragon X70 Ivy V510 5G
4G support LTE Cat-15 DL/Cat-13 UL

Additional Features

AI Qualcomm Hexagon NPU NPU - 4.8 TOPS
VDSP - VQ7
Charging Qualcomm Quick Charge 5 technology Fast Charging Support
Bluetooth 5.4 5.0
Wi-Fi 7 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 8s Gen 3 Unisoc Tanggula T770