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Snapdragon 8s Gen 3 vs Dimensity 700

We have assessed two 8-core mobile processors: Qualcomm Snapdragon 8s Gen 3 and MediaTek Dimensity 700. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 8s Gen 3
SM8650
Dimensity 700
MT6833V/ZA
Announced March 18, 2024 November 10, 2020

CPU & GPU

CPU 1x Cortex-X4 @ 3.0 GHz
4x Cortex-A720 @ 2.8 GHz
3x Cortex-A520 @ 2.0 GHz
2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
GPU Adreno 700 @ 1100 MHz ARM Mali-G57 MP2 @ 950 MHz
Process 4nm 7nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 64MP, 2x 16MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR4X up to 12 GB
RAM Frequency 4200 MHz 2133 MHz
Storage Type UFS 4.0 UFS 2.2

Display

Resolution 3840 x 2160 2520 x 1080
Display Type HDR Vivid, HDR10, HDR10+ Full HD+

AnTuTu

Score 1554839 387201

Geekbench

Single core 2019 711
Multi core 5570 1783

Network

5G Support
Modem Snapdragon X70 Integrated 5G Modem
4G support LTE Cat. 18

Additional Features

AI Qualcomm Hexagon NPU Yes
Charging Qualcomm Quick Charge 5 technology Fast Charging Support
Bluetooth 5.4 5.1
Wi-Fi 7 5
NFC
GPS
FM Radio
  Qualcomm Snapdragon 8s Gen 3 MediaTek Dimensity 700