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  4. Qualcomm Snapdragon 888 vs HiSilicon Kirin 990

Qualcomm Snapdragon 888 vs HiSilicon Kirin 990

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 888
SM8350
Kirin 990 5G
Announced December 1, 2020 October 6, 2019

CPU & GPU

CPU 1x Kryo 680 Prime (Cortex-X1) @ 2.84 GHz
3x Kryo 680 Gold (Cortex-A78) @ 2.42 GHz
4x Kryo 680 Silver (Cortex-A55) @ 1.8 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU Adreno 660 @ 792 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 5nm 7nm
Core 8-Core 8-Core

Camera

Max Camera Resolution 1x 200MP, 2x 25MP 1x 64MP

RAM & Storage

RAM Type LPDDR5 up to 24 GB LPDDR4X up to 12 GB
RAM Frequency 3200 MHz 2133 MHz
Storage Type UFS 3.0
UFS 3.1
UFS 2.1
UFS 3.0

Display

Resolution 3840 x 2160 3360 x 1440
Display Type 4K
QHD+
4K UHD
Full HD+

AnTuTu

Score 892658 560795

Geekbench

Single core 1543 766
Multi core 3823 3061

Network

5G Support
Modem Qualcomm Snapdragon X60 5G modem-RF system
4G support LTE Cat. 22
Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI Hexagon 780 Processor
6th generation Qualcomm AI Engine
HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Quick Charge 5 technology Fast Charging Support
Bluetooth 5.2 5.0
Wi-Fi 6 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 888 HiSilicon Kirin 990 5G