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Snapdragon 870 vs Dimensity 1000 Plus

We have assessed two 8-core mobile processors: Qualcomm Snapdragon 870 and MediaTek Dimensity 1000 Plus. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.

The Qualcomm Snapdragon 870 features a tri-cluster 64-Bit octa-core CPU that integrates 1 ARM Cortex-A77 Big core operating at up to 3.20GHz, 3 Cortex-A77 Gold cores at 2.42GHz, and 4 Cortex-A55 Silver cores at 1.8GHz clock speed while the MediaTek Dimensity 1000 Plus also features a dual-cluster 64-Bit octa-core CPU that includes 4 ARM Cortex-A77 Performance cores clocked at up to 2.60GHz and other 4 Cortex-A55 Efficiency cores at 2.00GHz clock speed.

For gaming purposes, the SD 870 has an Adreno 650 GPU while the Dimensity 1000 Plus features an ARM Mali-G77 MP9 GPU coupled with HyperEngine 2.0 Technology.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 870
SM8250-AC
Dimensity 1000 Plus
MT6889ZCZA
Announced January 19, 2021 May 8, 2020

CPU & GPU

CPU 1x Kryo 585 Prime (Cortex-A77) @ 3.2 GHz
3x Kryo 585 Gold (Cortex-A77) @ 2.42 GHz
4x Kryo 585 Silver (Cortex-A55) @ 1.8 GHz
4x Cortex-A77 @ 2.6 GHz
4x Cortex-A55 @ 2.0 GHz
GPU Adreno 650 @ 670 MHz ARM Mali-G77 MP9 @ 850 MHz
Process 7nm 7nm
Core 8-Core 8-Core

Camera

Max Camera Resolution 1x 200MP, 2x 25MP 1x 80MP, 2x 32MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR4X
RAM Frequency 2750 MHz 1866 MHz
Storage Type UFS 3.0
UFS 3.1
UFS 2.2

Display

Resolution 3840 x 2160 2520 x 1080
Display Type 4K
QHD+
Full HD+

AnTuTu

Score 870854 582561

Geekbench

Single core 1241 1031
Multi core 3417 3123

Network

5G Support
Modem Qualcomm Snapdragon X55 Integrated 5G Modem
4G support LTE Cat. 18

Additional Features

AI Hexagon 698 MediaTek APU 3.0
Charging Quick Charge 4+ technology No
Bluetooth 5.2 5.1
Wi-Fi 6 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 870 MediaTek Dimensity 1000 Plus