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  4. Qualcomm Snapdragon 860 vs HiSilicon Kirin 990

Qualcomm Snapdragon 860 vs HiSilicon Kirin 990

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 860
SM8150-AC
Kirin 990 5G
Announced April 7, 2019 October 6, 2019

CPU & GPU

CPU 1x Cortex-A76 (Kryo 485 Prime) @ 2.96 GHz
3x Cortex-A76 (Kryo 485 Gold) @ 2.42 GHz
4x Cortex-A55 (Kryo 485 Silver) @ 1.8 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU Adreno 640 @ 675 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 7nm 7nm
Core 8-Core 8-Core

Camera

Max Camera Resolution 1x 192MP, 2x 22MP 1x 64MP

RAM & Storage

RAM Type LPDDR4X up to 16 GB LPDDR4X up to 12 GB
RAM Frequency 2133 MHz 2133 MHz
Storage Type UFS 3.0
UFS 3.1
UFS 2.1
UFS 3.0

Display

Resolution 3840 x 2160 3360 x 1440
Display Type 4K Ultra HD 4K UHD
Full HD+

AnTuTu

Score 518220 560795

Geekbench

Single core 834 766
Multi core 2911 3061

Network

5G Support
Modem Qualcomm Snapdragon X50 5G Modem-RF System
4G support LTE Cat. 24
Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI Hexagon 690 HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Quick Charge 4+ technology Fast Charging Support
Bluetooth 5.1 5.0
Wi-Fi 6 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 860 HiSilicon Kirin 990 5G