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  4. Qualcomm Snapdragon 765G vs HiSilicon Kirin 810

Qualcomm Snapdragon 765G vs HiSilicon Kirin 810

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 765G
SM7250-AB
Kirin 810
Hi6280
Announced December 4, 2019 June 21, 2019

CPU & GPU

CPU 1x Kryo 475 Prime (Cortex-A76) @ 2.4 GHz
1x Kryo 475 Gold (Cortex-A76) @ 2.2 GHz
6x Kryo 475 Silver (Cortex-A55) @ 1.8 GHz
2x Cortex-A76 @ 2.27 GHz
6x Cortex-A55 @ 1.9 GHz
GPU Adreno 620 @ 750 MHz ARM's Mali-G52 MP6 @ 820 MHz
Process 7nm 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 192MP 1x 48MP, 2x 20MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR4X up to 8 GB
RAM Frequency 2133 MHz 2133 MHz
Storage Type eMMC 5.1, UFS 3.0 eMMC 5.1
UFS 2.1

Display

Resolution 3200 x 1800 3840 x 2160
Display Type Full HD+
QHD+
Full HD+

AnTuTu

Score 390732 375511

Geekbench

Single core 797 610
Multi core 1844 2005

Network

5G Support
Modem Qualcomm Snapdragon X52 Integrated Modem 4G support LTE Cat. 12

Additional Features

AI Hexagon 696 Processor HUAWEI Da Vinci Architecture
Ascend D100 Lite
Charging Quick Charge 4+ technology Fast Charging Support
Bluetooth 5.0 5.0
Wi-Fi 6 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 765G HiSilicon Kirin 810