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Snapdragon 7 plus Gen 3 vs Tanggula T770

In our comparison of two 8-core mobile processors, Qualcomm Snapdragon 7 plus Gen 3 and Unisoc Tanggula T770, we provide an in-depth look at their benchmark performance on AnTuTu and Geekbench. Additionally, you will find their technical specifications and other pertinent information to help you understand their capabilities.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 7 Plus Gen 3
SM7675
Tanggula T770
Announced March 21, 2024 July 2021

CPU & GPU

CPU 1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
1x Cortex-A76 @ 2.5 GHz
3x Cortex-A76 @ 2.5 GHz
4x Cortex-A55 @ 2.5 GHz
GPU Adreno 732 @ 950 MHz ARM Mali-G57
Process 4nm 6nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 108MP, 2x 24MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR4X up to 16 GB
RAM Frequency 4200 MHz 2133 MHz
Storage Type UFS 4.0 eMMC 5.1
UFS 3.1

Display

Resolution 3840 x 2160 2160 x 1080
Display Type WFHD+ @ 168 Hz, WQHD+ @ 120 Hz 4K
Full HD+
QHD+

AnTuTu

Score 1366982 317736

Geekbench

Single core 1913 656
Multi core 5098 2621

Network

5G Support
Modem Snapdragon X63 Ivy V510 5G
4G support LTE Cat-15 DL/Cat-13 UL

Additional Features

AI Qualcomm Hexagon™ NPU NPU - 4.8 TOPS
VDSP - VQ7
Charging Qualcomm Quick Charge 5 Technology Fast Charging Support
Bluetooth 5.4 5.0
Wi-Fi 7 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 7 Plus Gen 3 Unisoc Tanggula T770