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Snapdragon 7 plus Gen 3 vs Tanggula T760
We have evaluated two 8-core mobile processors, Qualcomm Snapdragon 7 plus Gen 3 and Unisoc Tanggula T760. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.
General
Device Type
|
Mobile Platform
Mobile Platform
|
Model
|
Snapdragon 7 Plus Gen 3 SM7675
Tanggula T760
|
Announced
|
March 21, 2024
April 2021
|
CPU & GPU
CPU
|
1x Cortex-X4 @ 2.8 GHz 4x Cortex-A720 @ 2.6 GHz 3x Cortex-A520 @ 1.9 GHz
4x Cortex-A76 @ 2.2 GHz 4x Cortex-A55 @ 2.2 GHz
|
GPU
|
Adreno 732 @ 950 MHz
ARM Mali G57
|
Process
|
4nm
6nm
|
Core
|
8-core
8-core
|
Camera
Max Camera Resolution
|
1x 200MP
1x 64MP
|
RAM & Storage
RAM Type
|
LPDDR5X up to 24 GB
LPDDR4X up to 32 GB
|
RAM Frequency
|
4200 MHz
2133 MHz
|
Storage Type
|
UFS 4.0
eMMC 5.1 UFS 3.1
|
Display
Resolution
|
3840 x 2160
2160 x 1080
|
Display Type
|
WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+ @ 120 FPS
|
Geekbench
Single core
|
1913
570
|
Multi core
|
5098
2279
|
Network
5G Support
|
|
Modem
|
Snapdragon X63
Ivy V510 5G 4G support LTE Cat-15 DL/Cat-13 UL
|
Additional Features
AI
|
Qualcomm Hexagon™ NPU
NPU - 2.4 TOPS VDSP - VQ7
|
Charging
|
Qualcomm Quick Charge 5 Technology
Fast Charging Support
|
Bluetooth
|
5.4
5.0
|
Wi-Fi
|
7
6
|
NFC
|
|
GPS
|
|
FM Radio
|
|