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Snapdragon 7 plus Gen 3 vs Dimensity 8300 Ultra

In our comparison of two 8-core mobile processors, Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 8300 Ultra, we provide an in-depth look at their benchmark performance on AnTuTu and Geekbench. Additionally, you will find their technical specifications and other pertinent information to help you understand their capabilities.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 7 Plus Gen 3
SM7675
Dimensity 8300
Announced March 21, 2024 November 21, 2023

CPU & GPU

CPU 1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
1x ARM Cortex-A715 @ 3.35 GHz
3x ARM Cortex-A715 @ 3.2 GHz
4x ARM Cortex-A510 @ 2.2 GHz
GPU Adreno 732 @ 950 MHz Arm Mali-G615 MP6 @ 1400 MHz
Process 4nm TSMC 4nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 320MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR5X up to 24 GB
RAM Frequency 4200 MHz 4266 MHz
Storage Type UFS 4.0 UFS 4.0 + MCQ

Display

Resolution 3840 x 2160 Up to 2960 x 1440 px
Display Type WFHD+ @ 168 Hz, WQHD+ @ 120 Hz MediaTek MiraVision 880, HDR10+ Adaptive support

AnTuTu

Score 1366982 1473164

Geekbench

Single core 1913 1550
Multi core 5098 4839

Network

5G Support
Modem Snapdragon X63 Sub 6GHz 5G

Additional Features

AI Qualcomm Hexagon™ NPU MediaTek APU 780 (multi-core)
Charging Qualcomm Quick Charge 5 Technology Fast Charging support
Bluetooth 5.4 5.4
Wi-Fi 7 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 7 Plus Gen 3 MediaTek Dimensity 8300 Ultra