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Snapdragon 7 plus Gen 3 vs Dimensity 8250

We have evaluated two 8-core mobile processors, Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 8250. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 7 Plus Gen 3
SM7675
Dimensity 8250
Announced March 21, 2024 May 13, 2024

CPU & GPU

CPU 1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
1x Cortex-A78 @ 3.1 GHz
3x Cortex-A78 @ 3.0 GHz
4x Cortex-A55 @ 2.0 GHz
GPU Adreno 732 @ 950 MHz Arm Mali-G610 MP6 @ 950 MHz
Process 4nm TSMC 4nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 320MP, 3x 32MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR5 up to 16 GB
RAM Frequency 4200 MHz 6400 MHz
Storage Type UFS 4.0 UFS 3.1

Display

Resolution 3840 x 2160 2960 x 1440
Display Type WFHD+ @ 168 Hz, WQHD+ @ 120 Hz Full HD+ @ up to 180Hz
WQHD @ up to 120Hz

AnTuTu

Score 1366982 923779

Geekbench

Single core 1913 1384
Multi core 5098 4091

Network

5G Support
Modem Snapdragon X63 3GPP Release 16 5G Modem
MediaTek UltraSave 2.0
3CC Carrier Aggregation (200MHz) 5G sub-6GHz
4G support LTE Cat. 21

Additional Features

AI Qualcomm Hexagon™ NPU MediaTek APU 580
Charging Qualcomm Quick Charge 5 Technology 120W Fast charging support
Bluetooth 5.4 5.3
Wi-Fi 7 6E
NFC
GPS
FM Radio
  Qualcomm Snapdragon 7 Plus Gen 3 MediaTek Dimensity 8250