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Snapdragon 7 plus Gen 3 vs Dimensity 820
We have assessed two 8-core mobile processors: Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 820. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.
General
|
Device Type
|
Mobile Platform
Mobile Platform
|
|
Model
|
Snapdragon 7 Plus Gen 3
SM7675
Dimensity 820
MT6875
|
|
Announced
|
March 21, 2024
May 18, 2020
|
CPU & GPU
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CPU
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1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
4x Cortex-A76 @ 2.60 GHz
4x Cortex-A55 @ 2.00 GHz
|
|
GPU
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Adreno 732 @ 950 MHz
ARM Mali-G57 MC5 @ 650 MHz
|
|
Process
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4nm
7nm
|
|
Core
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8-core
8-Core
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Camera
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Max Camera Resolution
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1x 200MP
1x 80MP, 2x 32MP
|
RAM & Storage
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RAM Type
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LPDDR5X up to 24 GB
LPDDR4X up to 16 GB
|
|
RAM Frequency
|
4200 MHz
2133 MHz
|
|
Storage Type
|
UFS 4.0
UFS 2.2
|
Display
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Resolution
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3840 x 2160
2520 x 1080
|
|
Display Type
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WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+
|
Geekbench
|
Single core
|
1913
942
|
|
Multi core
|
5098
2494
|
Network
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5G Support
|
|
|
Modem
|
Snapdragon X63
Integrated 5G Modem
4G support LTE Cat. 18
|
Additional Features
|
AI
|
Qualcomm Hexagon™ NPU
MediaTek’s APU 3.0
|
|
Charging
|
Qualcomm Quick Charge 5 Technology
-
|
|
Bluetooth
|
5.4
5.1
|
|
Wi-Fi
|
7
5
|
|
NFC
|
|
|
GPS
|
|
|
FM Radio
|
|
