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Snapdragon 7 plus Gen 3 vs Dimensity 8100
We have assessed two 8-core mobile processors: Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 8100. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.
General
|
Device Type
|
Mobile Platform
Mobile Platform
|
|
Model
|
Snapdragon 7 Plus Gen 3
SM7675
Dimensity 8100
MT6895Z
|
|
Announced
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March 21, 2024
March 1, 2022
|
CPU & GPU
|
CPU
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1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
4x Cortex-A78 @ 2.85 GHz
4x Cortex-A55 @ 2.0 GHz
|
|
GPU
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Adreno 732 @ 950 MHz
ARM Mali-G610 MC6 @ 860 MHz
|
|
Process
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4nm
TSMC's 5nm
|
|
Core
|
8-core
8-Core
|
Camera
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Max Camera Resolution
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1x 200MP
1x 200MP
|
RAM & Storage
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RAM Type
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LPDDR5X up to 24 GB
LPDDR5 up to 16 GB
|
|
RAM Frequency
|
4200 MHz
3200 MHz
|
|
Storage Type
|
UFS 4.0
UFS 3.1
|
Display
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Resolution
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3840 x 2160
2960 x 1440
|
|
Display Type
|
WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+
|
Geekbench
|
Single core
|
1913
1140
|
|
Multi core
|
5098
4624
|
Network
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5G Support
|
|
|
Modem
|
Snapdragon X63
MediaTek UltraSave 2.0
|
Additional Features
|
AI
|
Qualcomm Hexagon™ NPU
MediaTek APU 580
|
|
Charging
|
Qualcomm Quick Charge 5 Technology
Fast Charging Support
|
|
Bluetooth
|
5.4
5.3
|
|
Wi-Fi
|
7
6
|
|
NFC
|
|
|
GPS
|
|
|
FM Radio
|
|
