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Snapdragon 7 plus Gen 3 vs Dimensity 810
We have analyzed two 8-core mobile processors: Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 810. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
General
|
Device Type
|
Mobile Platform
Mobile Platform
|
|
Model
|
Snapdragon 7 Plus Gen 3
SM7675
Dimensity 810
MT6833V
|
|
Announced
|
March 21, 2024
August 11, 2021
|
CPU & GPU
|
CPU
|
1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
2x Cortex-A76 @ 2.40 GHz
6x Cortex-A55 @ 2.00 GHz
|
|
GPU
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Adreno 732 @ 950 MHz
ARM Mali-G57 MP2 @ 950 MHz
|
|
Process
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4nm
6nm
|
|
Core
|
8-core
8-Core
|
Camera
|
Max Camera Resolution
|
1x 200MP
1x 64MP, 2x 16MP
|
RAM & Storage
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RAM Type
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LPDDR5X up to 24 GB
LPDDR4X up to 16 GB
|
|
RAM Frequency
|
4200 MHz
2133 MHz
|
|
Storage Type
|
UFS 4.0
UFS 2.2
|
Display
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Resolution
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3840 x 2160
2520 x 1080
|
|
Display Type
|
WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
Full HD+
|
Geekbench
|
Single core
|
1913
819
|
|
Multi core
|
5098
1992
|
Network
|
5G Support
|
|
|
Modem
|
Snapdragon X63
Integrated 5G Modem
4G support LTE Cat. 18
|
Additional Features
|
AI
|
Qualcomm Hexagon™ NPU
MediaTek APU 3.0
|
|
Charging
|
Qualcomm Quick Charge 5 Technology
Fast Charging Support
|
|
Bluetooth
|
5.4
5.1
|
|
Wi-Fi
|
7
5
|
|
NFC
|
|
|
GPS
|
|
|
FM Radio
|
|
