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Snapdragon 7 plus Gen 3 vs Dimensity 7200

We have evaluated two 8-core mobile processors, Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 7200. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 7 Plus Gen 3
SM7675
Dimensity 7200
Announced March 21, 2024 February 16, 2023

CPU & GPU

CPU 1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
2x Cortex-A715 @ 2.8 GHz
6x Cortex-A510 @ 2.0 GHz
GPU Adreno 732 @ 950 MHz Arm Mali-G610 MP4 @ 1130 MHz
Process 4nm 4nm (2nd-Gen TSMC)
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 200MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR5 up to 16 GB
RAM Frequency 4200 MHz 3200 MHz
Storage Type UFS 4.0 UFS 3.1

Display

Resolution 3840 x 2160 2520 x 1080
Display Type WFHD+ @ 168 Hz, WQHD+ @ 120 Hz Full HD+ @ 144Hz

AnTuTu

Score 1366982 712093

Geekbench

Single core 1913 1187
Multi core 5098 2643

Network

5G Support
Modem Snapdragon X63 5G modem
MediaTek 5G UltraSave 2.0 technology
Downlink performance up to 4.7Gbps and dual 5G SIM
2G-5G Multi-Mode

Additional Features

AI Qualcomm Hexagon™ NPU MediaTek APU 650
Charging Qualcomm Quick Charge 5 Technology Fast Charging Support
Bluetooth 5.4 5.3
Wi-Fi 7 6
NFC
GPS
FM Radio
  Qualcomm Snapdragon 7 Plus Gen 3 MediaTek Dimensity 7200