1. Home
  2. Products
  3. Compare
  4. Snapdragon 7 plus Gen 3 vs Dimensity 7050

Snapdragon 7 plus Gen 3 vs Dimensity 7050

We have analyzed two 8-core mobile processors: Qualcomm Snapdragon 7 plus Gen 3 and MediaTek Dimensity 7050. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 7 Plus Gen 3
SM7675
Dimensity 7050
Announced March 21, 2024 May 2, 2023

CPU & GPU

CPU 1x Cortex-X4 @ 2.8 GHz
4x Cortex-A720 @ 2.6 GHz
3x Cortex-A520 @ 1.9 GHz
2x Cortex-A78 @ 2.6 GHz
6x Cortex-A55 @ 2 GHz
GPU Adreno 732 @ 950 MHz Arm Mali-G68 MP4 @ 800 MHz
Process 4nm TSMC 6nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 200MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR5 up to 16 GB
RAM Frequency 4200 MHz 2750 Mhz
Storage Type UFS 4.0 UFS 3.1
UFS 2.1

Display

Resolution 3840 x 2160 2520 x 1080
Display Type WFHD+ @ 168 Hz, WQHD+ @ 120 Hz Full HD+ @ 120Hz Refresh rate

AnTuTu

Score 1366982 502001

Geekbench

Single core 1913 840
Multi core 5098 2300

Network

5G Support
Modem Snapdragon X63 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA

Additional Features

AI Qualcomm Hexagon™ NPU MediaTek APU 550
Charging Qualcomm Quick Charge 5 Technology Fast charging support
Bluetooth 5.4 5.2
Wi-Fi 7 6 (a/b/g/n/ac/ax)
NFC
GPS
FM Radio
  Qualcomm Snapdragon 7 Plus Gen 3 MediaTek Dimensity 7050