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Snapdragon 7 Gen 3 vs Dimensity 9000 Plus

We have evaluated two 8-core mobile processors, Qualcomm Snapdragon 7 Gen 3 and MediaTek Dimensity 9000 Plus. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.

General

Device Type Mobile Platform Mobile Platform
Model Snapdragon 7 Gen 3
SM7550-AB
Dimensity 9000 Plus
Announced November 17, 2023 July 4, 2022

CPU & GPU

CPU 1x Cortex-A715 @ 2.63 GHz
3x Cortex-A715 @ 2.4 GHz
4x Cortex-A510 @ 1.8 GHz
1x Cortex-X2 @ 3.2 GHz
3x Cortex-A710 @ 2.85 GHz
4x Cortex-A510 @ 1.8 GHz
GPU Adreno 720 Arm Mali-G710 MP10 @ 933 MHz
Process 4nm 4nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 320MP, 3x 32MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR5X up to 24 GB
RAM Frequency 3200 MHz 3750 MHz
Storage Type UFS 3.1 UFS 3.1

Display

Resolution 3360 x 1600 2960 x 1440
Display Type WFHD+ @ 168 Hz, WQHD+ @ 120 Hz Full HD+
WQHD+

AnTuTu

Score 873939 1184670

Geekbench

Single core 1149 1647
Multi core 3388 4481

Network

5G Support
Modem Snapdragon X63 Integrated multimode 5G modem
4G support LTE Cat. 24
MediaTek 5G UltraSave 2.0
Sub-6GHz
Downlink: 7Gbps
3CC Carrier Aggregation 300MHz.

Additional Features

AI Qualcomm Hexagon™ NPU MediaTek APU 590 (5th generation)
Charging Qualcomm Quick Charge 5 Technology Fast Charging Support
Bluetooth 5.3 5.3
Wi-Fi 6 6E
NFC
GPS
FM Radio
  Qualcomm Snapdragon 7 Gen 3 MediaTek Dimensity 9000 Plus