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  4. MediaTek Dimensity 9300 Plus vs HiSilicon Kirin 990 5G

MediaTek Dimensity 9300 Plus vs HiSilicon Kirin 990 5G

We have analyzed two 8-core mobile processors: MediaTek Dimensity 9300 Plus and HiSilicon Kirin 990 5G. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 9300 Plus Kirin 990 5G
Announced May 7, 2024 October 6, 2019

CPU & GPU

CPU 1x ARM Cortex-X4 @ 3.4 GHz
3x ARM Cortex-X4 @ 2.85 GHz
4x ARM Cortex-A720 @ 2.0 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU ARM Immortalis-G720 MC12 @ 1300 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 4nm (3rd generation) 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 320MP 1x 64MP

RAM & Storage

RAM Type LPDDR5T up to 24 GB LPDDR4X up to 12 GB
RAM Frequency 4800 MHz 2133 MHz
Storage Type UFS 4.0 UFS 2.1
UFS 3.0

Display

Resolution 3840 x 2160 3360 x 1440
Display Type WQHD 180Hz, or 4K120 4K UHD
Full HD+

AnTuTu

Score 2957733 560795

Geekbench

Single core 3239 766
Multi core 8538 3061

Network

5G Support
Modem MediaTek T830 Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI MediaTek APU 790 HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging 120W Fast Charging support Fast Charging Support
Bluetooth 5.4 5.0
Wi-Fi 7 (MediaTek Xtra Range 2.0) 6
NFC
GPS
FM Radio
  MediaTek Dimensity 9300 Plus HiSilicon Kirin 990 5G