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  4. MediaTek Dimensity 900 vs HiSilicon Kirin 990

MediaTek Dimensity 900 vs HiSilicon Kirin 990

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 900
MT6877
Kirin 990 5G
Announced May 13, 2021 October 6, 2019

CPU & GPU

CPU 2x Cortex-A78 @ 2.4 GHz
6x Cortex-A55 @ 2 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU Mali-G68 MP4 @ 900 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 6nm 7nm
Core 8-Core 8-Core

Camera

Max Camera Resolution 1x 108MP, 2x 20MP 1x 64MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR4X up to 12 GB
RAM Frequency 3200 MHz 2133 MHz
Storage Type UFS 3.1 UFS 2.1
UFS 3.0

Display

Resolution 2520 x 1080 3360 x 1440
Display Type Full HD+ 4K UHD
Full HD+

AnTuTu

Score 476042 560795

Geekbench

Single core 701 766
Multi core 2136 3061

Network

5G Support
Modem Integrated 5G Modem
4G support LTE Cat. 18
Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI MediaTek APU 3.0 HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Fast Charging Support Fast Charging Support
Bluetooth 5.2 5.0
Wi-Fi 6 6
NFC
GPS
FM Radio
  MediaTek Dimensity 900 HiSilicon Kirin 990 5G