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  4. MediaTek Dimensity 8300 vs HiSilicon Kirin 9000

MediaTek Dimensity 8300 vs HiSilicon Kirin 9000

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 8300 Kirin 9000
Announced November 21, 2023 October 22, 2020

CPU & GPU

CPU 1x ARM Cortex-A715 @ 3.35 GHz
3x ARM Cortex-A715 @ 3.2 GHz
4x ARM Cortex-A510 @ 2.2 GHz
1x Cortex-A77 @ 3.13 GHz
3x Cortex-A77 @ 2.54 GHz
4x Cortex-A55 @ 2.05 GHz
GPU Arm Mali-G615 MP6 @ 1400 MHz ARM Mali-G78
MP24
Process TSMC 4nm 5nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 320MP 1x 108MP, 2x 32MP

RAM & Storage

RAM Type LPDDR5X up to 24 GB LPDDR5 up to 16 GB
RAM Frequency 4266 MHz 2750 MHz
Storage Type UFS 4.0 + MCQ UFS 3.1

Display

Resolution Up to 2960 x 1440 px 4096 × 2160
Display Type MediaTek MiraVision 880, HDR10+ Adaptive support 4K UHD

AnTuTu

Score 1473164 686549

Geekbench

Single core 1550 1047
Multi core 4839 3645

Network

5G Support
Modem Sub 6GHz 5G Balong 5000 5G Modem
4G support LTE Cat. 24

Additional Features

AI MediaTek APU 780 (multi-core) Yes
Charging Fast Charging support
Bluetooth 5.4 5.2
Wi-Fi 6 6
NFC
GPS
FM Radio
  MediaTek Dimensity 8300 Ultra HiSilicon Kirin 9000