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  4. MediaTek Dimensity 8100 Max vs HiSilicon Kirin 990 5G

MediaTek Dimensity 8100 Max vs HiSilicon Kirin 990 5G

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 8100 Max Kirin 990 5G
Announced May 1, 2022 October 6, 2019

CPU & GPU

CPU 4x Cortex-A78 @ 2.85 GHz
4x Cortex-A55 @ 2.0 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU ARM Mali-G610 MC6 @ 980 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 5nm 7nm
Core 8-Core 8-Core

Camera

Max Camera Resolution 1x 200MP 1x 64MP

RAM & Storage

RAM Type LPDDR5 up 16 GB LPDDR4X up to 12 GB
RAM Frequency 3200 MHz 2133 MHz
Storage Type UFS 3.1 UFS 2.1
UFS 3.0

Display

Resolution 2960 x 1440 3360 x 1440
Display Type Full HD+
IPS LCD
Refresh rate 120Hz
4K UHD
Full HD+

AnTuTu

Score 988262 560795

Geekbench

Single core 1542 766
Multi core 5652 3061

Network

5G Support
Modem MediaTek UltraSave 2.0 Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI MediaTek APU 580 HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Fast Charging Support Fast Charging Support
Bluetooth 5.3 5.0
Wi-Fi 6E 6
NFC
GPS
FM Radio
  MediaTek Dimensity 8100 Max HiSilicon Kirin 990 5G