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  4. MediaTek Dimensity 8050 vs HiSilicon Kirin 990 5G

MediaTek Dimensity 8050 vs HiSilicon Kirin 990 5G

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 8050
MT6893
Kirin 990 5G
Announced May 9, 2023 October 6, 2019

CPU & GPU

CPU 1x Cortex-A78 @ 3.0 GHz
3x Cortex-A78 @ 2.6 GHz
4x Cortex-A55 @ 2.0 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU ARM Mali-G77 MP9 @ 850 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 6nm 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 200MP 1x 64MP

RAM & Storage

RAM Type LPDDR4X up to 16 GB LPDDR4X up to 12 GB
RAM Frequency 2133 MHz 2133 MHz
Storage Type UFS 3.1 UFS 2.1
UFS 3.0

Display

Resolution 2520 x 1080 3360 x 1440
Display Type HD+ | QHD+ 4K UHD
Full HD+

AnTuTu

Score 752312 560795

Geekbench

Single core 1097 766
Multi core 3359 3061

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI MediaTek APU 570 HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Fast charging support Fast Charging Support
Bluetooth 5.2 5.0
Wi-Fi 6 6
NFC
GPS
FM Radio
  MediaTek Dimensity 8050 HiSilicon Kirin 990 5G