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  4. MediaTek Dimensity 7200 vs HiSilicon Kirin 990 5G

MediaTek Dimensity 7200 vs HiSilicon Kirin 990 5G

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 7200 Kirin 990 5G
Announced February 16, 2023 October 6, 2019

CPU & GPU

CPU 2x Cortex-A715 @ 2.8 GHz
6x Cortex-A510 @ 2.0 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU Arm Mali-G610 MP4 @ 1130 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 4nm (2nd-Gen TSMC) 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 200MP 1x 64MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR4X up to 12 GB
RAM Frequency 3200 MHz 2133 MHz
Storage Type UFS 3.1 UFS 2.1
UFS 3.0

Display

Resolution 2520 x 1080 3360 x 1440
Display Type Full HD+ @ 144Hz 4K UHD
Full HD+

AnTuTu

Score 712093 560795

Geekbench

Single core 1187 766
Multi core 2643 3061

Network

5G Support
Modem 5G modem
MediaTek 5G UltraSave 2.0 technology
Downlink performance up to 4.7Gbps and dual 5G SIM
2G-5G Multi-Mode
Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI MediaTek APU 650 HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Fast Charging Support Fast Charging Support
Bluetooth 5.3 5.0
Wi-Fi 6 6
NFC
GPS
FM Radio
  MediaTek Dimensity 7200 HiSilicon Kirin 990 5G