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  4. MediaTek Dimensity 7050 vs Qualcomm Snapdragon 860

MediaTek Dimensity 7050 vs Qualcomm Snapdragon 860

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 7050 Snapdragon 860
SM8150-AC
Announced May 2, 2023 April 7, 2019

CPU & GPU

CPU 2x Cortex-A78 @ 2.6 GHz
6x Cortex-A55 @ 2 GHz
1x Cortex-A76 (Kryo 485 Prime) @ 2.96 GHz
3x Cortex-A76 (Kryo 485 Gold) @ 2.42 GHz
4x Cortex-A55 (Kryo 485 Silver) @ 1.8 GHz
GPU Arm Mali-G68 MP4 @ 800 MHz Adreno 640 @ 675 MHz
Process TSMC 6nm 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 200MP 1x 192MP, 2x 22MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR4X up to 16 GB
RAM Frequency 2750 Mhz 2133 MHz
Storage Type UFS 3.1
UFS 2.1
UFS 3.0
UFS 3.1

Display

Resolution 2520 x 1080 3840 x 2160
Display Type Full HD+ @ 120Hz Refresh rate 4K Ultra HD

AnTuTu

Score 502001 518220

Geekbench

Single core 840 834
Multi core 2300 2911

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Qualcomm Snapdragon X50 5G Modem-RF System
4G support LTE Cat. 24

Additional Features

AI MediaTek APU 550 Hexagon 690
Charging Fast charging support Quick Charge 4+ technology
Bluetooth 5.2 5.1
Wi-Fi 6 (a/b/g/n/ac/ax) 6
NFC
GPS
FM Radio
  MediaTek Dimensity 7050 Qualcomm Snapdragon 860