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Dimensity 7050 vs Snapdragon 778G Plus

We have analyzed two 8-core mobile processors: MediaTek Dimensity 7050 and Qualcomm Snapdragon 778G Plus. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 7050 Snapdragon 778G Plus
SM7325-AE
Announced May 2, 2023 October 27, 2021

CPU & GPU

CPU 2x Cortex-A78 @ 2.6 GHz
6x Cortex-A55 @ 2 GHz
1x Kryo 670 Prime (Cortex-A78) @ 2.5 GHz
3x Kryo 670 Gold (Cortex-A78) @ 2.4 GHz
4x Kryo 670 Silver (Cortex-A55) @ 1.8 GHz
GPU Arm Mali-G68 MP4 @ 800 MHz Adreno 642 @ 608 MHz
Process TSMC 6nm 6nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 200MP 1x 192MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR5 up to 16 GB
RAM Frequency 2750 Mhz 3200 MHz
Storage Type UFS 3.1
UFS 2.1
UFS 2.2, UFS 3.0, UFS 3.1

Display

Resolution 2520 x 1080 2520 x 1080
Display Type Full HD+ @ 120Hz Refresh rate Full HD+

AnTuTu

Score 502001 624600

Geekbench

Single core 840 1064
Multi core 2300 3006

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Qualcomm Snapdragon X53

Additional Features

AI MediaTek APU 550 Qualcomm Hexagon 770
Charging Fast charging support Quick Charge 4+ technology
Bluetooth 5.2 5.2
Wi-Fi 6 (a/b/g/n/ac/ax) 6
NFC
GPS
FM Radio
  MediaTek Dimensity 7050 Qualcomm Snapdragon 778G Plus