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Dimensity 7025 vs Snapdragon 888 Plus

We have assessed two 8-core mobile processors: MediaTek Dimensity 7025 and Qualcomm Snapdragon 888 Plus. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 7025 Snapdragon 888 Plus
SM8350-AC
Announced April 10, 2024 June 28, 2021

CPU & GPU

CPU 2x Cortex-A78 @ 2.5 GHz
6x Cortex-A55 @ 2.0 GHz
1x Kryo 680 Prime (Cortex-X1) @ 2.995 GHz
3x Kryo 680 Gold (Cortex-A78) @ 2.42 GHz
4x Kryo 680 Silver (Cortex-A55) @ 1.8 GHz
GPU IMG BXM-8-256 @ 950 MHz Adreno 660 @ 905 MHz
Process 6nm 5nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 200MP 1x 200MP, 2x 25MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR5 up to 24 GB
RAM Frequency 3200 MHz 3200 MHz
Storage Type UFS 2.2, UFS 3.1 UFS 3.0
UFS 3.1

Display

Resolution 2520 x 1080 3840 x 2160
Display Type Full HD+ @ Refresh Rate 120Hz 4K Full HD+

AnTuTu

Score 495066 897842

Geekbench

Single core 1024 1750
Multi core 2472 3987

Network

5G Support
Modem 2G-5G Multi-Mode
5G Carrier Aggregation (CA), 5G FDD / TDD
4G Carrier Aggregation (CA)
4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM

Snapdragon X60

Additional Features

AI Mediatek NPU Hexagon 780
Charging Fast charging support Quick Charge 5.0 technology
Bluetooth 5.3 5.2
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 7025 Qualcomm Snapdragon 888 Plus