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MediaTek Dimensity 7025 vs HiSilicon Kirin 990 5G

We have assessed two 8-core mobile processors: MediaTek Dimensity 7025 and HiSilicon Kirin 990 5G. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 7025 Kirin 990 5G
Announced April 10, 2024 October 6, 2019

CPU & GPU

CPU 2x Cortex-A78 @ 2.5 GHz
6x Cortex-A55 @ 2.0 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU IMG BXM-8-256 @ 950 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 6nm 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 200MP 1x 64MP

RAM & Storage

RAM Type LPDDR5 up to 16 GB LPDDR4X up to 12 GB
RAM Frequency 3200 MHz 2133 MHz
Storage Type UFS 2.2, UFS 3.1 UFS 2.1
UFS 3.0

Display

Resolution 2520 x 1080 3360 x 1440
Display Type Full HD+ @ Refresh Rate 120Hz 4K UHD
Full HD+

AnTuTu

Score 495066 560795

Geekbench

Single core 1024 766
Multi core 2472 3061

Network

5G Support
Modem 2G-5G Multi-Mode
5G Carrier Aggregation (CA), 5G FDD / TDD
4G Carrier Aggregation (CA)
4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM

Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI Mediatek NPU HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Fast charging support Fast Charging Support
Bluetooth 5.3 5.0
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 7025 HiSilicon Kirin 990 5G