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MediaTek Dimensity 7025 vs HiSilicon Kirin 820
In our comparison of two 8-core mobile processors, MediaTek Dimensity 7025 and HiSilicon Kirin 820, we provide an in-depth look at their benchmark performance on AnTuTu and Geekbench. Additionally, you will find their technical specifications and other pertinent information to help you understand their capabilities.
General
|
Device Type
|
Mobile Platform
Mobile Platform
|
|
Model
|
Dimensity 7025
Kirin 820
|
|
Announced
|
April 10, 2024
March 30, 2020
|
CPU & GPU
|
CPU
|
2x Cortex-A78 @ 2.5 GHz
6x Cortex-A55 @ 2.0 GHz
1x Cortex-A76 @ 2.36 GHz
3x Cortex-A76 @ 2.22 GHz
4x Cortex-A55 @ 1.84 GHz
|
|
GPU
|
IMG BXM-8-256 @ 950 MHz
ARM Mali-G57 MP6 @ 850 MHz
|
|
Process
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6nm
7nm
|
|
Core
|
8-core
8-Core
|
Camera
|
Max Camera Resolution
|
1x 200MP
1x 48MP, 2x 20MP
|
RAM & Storage
|
RAM Type
|
LPDDR5 up to 16 GB
LPDDR4X up to 12 GB
|
|
RAM Frequency
|
3200 MHz
2133 MHz
|
|
Storage Type
|
UFS 2.2, UFS 3.1
UFS 2.1
|
Display
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Resolution
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2520 x 1080
3360 x 1440
|
|
Display Type
|
Full HD+ @ Refresh Rate 120Hz
Full HD+
|
Geekbench
|
Single core
|
1024
631
|
|
Multi core
|
2472
2429
|
Network
|
5G Support
|
|
|
Modem
|
2G-5G Multi-Mode
5G Carrier Aggregation (CA), 5G FDD / TDD
4G Carrier Aggregation (CA)
4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM
Integrated 5G Modem Balong 5000
4G support LTE Cat. 22
|
Additional Features
|
AI
|
Mediatek NPU
Da Vinci NPU
|
|
Charging
|
Fast charging support
|
|
Bluetooth
|
5.3
5.1
|
|
Wi-Fi
|
5
6
|
|
NFC
|
|
|
GPS
|
|
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FM Radio
|
|
