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MediaTek Dimensity 6300 vs HiSilicon Kirin 990 5G

In our comparison of two 8-core mobile processors, MediaTek Dimensity 6300 and HiSilicon Kirin 990 5G, we provide an in-depth look at their benchmark performance on AnTuTu and Geekbench. Additionally, you will find their technical specifications and other pertinent information to help you understand their capabilities.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6300 Kirin 990 5G
Announced April 19, 2024 October 6, 2019

CPU & GPU

CPU 2x Cortex-A76 @ 2.4 GHz
6x Cortex-A55 @ 2.0 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 6nm 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 64MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR4X up to 12 GB
RAM Frequency 2133 MHz 2133 MHz
Storage Type UFS 2.2 UFS 2.1
UFS 3.0

Display

Resolution 2520 x 1080 3360 x 1440
Display Type Full HD+ 4K UHD
Full HD+

AnTuTu

Score 447617 560795

Geekbench

Single core 813 766
Multi core 2135 3061

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI Yes HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Fast charging support Fast Charging Support
Bluetooth 5.2 5.0
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6300 HiSilicon Kirin 990 5G