In our comparison of two 8-core mobile processors, MediaTek Dimensity 6300 and HiSilicon Kirin 990 5G, we provide an in-depth look at their benchmark performance on AnTuTu and Geekbench. Additionally, you will find their technical specifications and other pertinent information to help you understand their capabilities.
Price | ₹99.00 ₹90.00 |
Our Rating | 6.2 6.6 |
Brand | MediaTek HiSilicon |
Category | Smartphone Processors Smartphone Processors |
Device Type | Mobile Platform Mobile Platform |
Model | Dimensity 6300 Kirin 990 5G |
Announced | April 19, 2024 October 6, 2019 |
CPU |
2x Cortex-A76 @ 2.4 GHz 6x Cortex-A55 @ 2.0 GHz 2x Cortex-A76 @ 2.86 GHz 2x Cortex-A76 @ 2.36 GHz 4x Cortex-A55 @ 1.95 GHz |
GPU | Arm Mali-G57 MP2 @ 950 MHz ARM Mali-G76 MP16 @ 600 MHz |
Process | 6nm 7nm |
Core | 8-core 8-Core |
Max Camera Resolution | 1x 108MP, 2x 16MP 1x 64MP |
RAM Type | LPDDR4X up to 12 GB LPDDR4X up to 12 GB |
RAM Frequency | 2133 MHz 2133 MHz |
Storage Type |
UFS 2.2
UFS 2.1 UFS 3.0 |
Resolution | 2520 x 1080 3360 x 1440 |
Display Type |
Full HD+
4K UHD Full HD+ |
Score | 447617 560795 |
Single core | 813 766 |
Multi core | 2135 3061 |
5G Support | |
Modem |
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA Balong 5000 5G modem 4G support LTE Cat. 21 |
AI |
Yes
HUAWEI Da Vinci Architecture 2x Ascend Lite + 1x Ascend Tiny HiAI 2.0 |
Charging | Fast charging support Fast Charging Support |
Bluetooth | 5.2 5.0 |
Wi-Fi | 5 6 |
NFC | |
GPS | |
FM Radio |