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  4. MediaTek Dimensity 6300 vs HiSilicon Kirin 9010

MediaTek Dimensity 6300 vs HiSilicon Kirin 9010

We have assessed two mobile processors: MediaTek Dimensity 6300 and HiSilicon Kirin 9010. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6300 Kirin 9010
Announced April 19, 2024 April 18, 2024

CPU & GPU

CPU 2x Cortex-A76 @ 2.4 GHz
6x Cortex-A55 @ 2.0 GHz
2x TaiShan V121 @ 2.3 GHz
4x TaiShan V121 @ 1.5 GHz
6x Cortex-A510 @ 2.18 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz Maleoon 910 @ 750 MHz
Process 6nm 7nm
Core 8-core 12-core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP Unknown

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR5 up to 16 GB
RAM Frequency 2133 MHz 2750 MHz
Storage Type UFS 2.2 UFS 3.1, UFS 4.0

Display

Resolution 2520 x 1080 3840 x 2160
Display Type Full HD+ Full HD+

AnTuTu

Score 447617 972547

Geekbench

Single core 813 1421
Multi core 2135 4323

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Balong 5000

Additional Features

AI Yes Da Vinci NPU
Charging Fast charging support Fast charging
Bluetooth 5.2 5.2
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6300 HiSilicon Kirin 9010