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MediaTek Dimensity 6100 Plus vs Unisoc Tanggula T770

We have analyzed two 8-core mobile processors: MediaTek Dimensity 6100 Plus and Unisoc Tanggula T770. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6100 Plus Tanggula T770
Announced July 12, 2023 July 2021

CPU & GPU

CPU 2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
1x Cortex-A76 @ 2.5 GHz
3x Cortex-A76 @ 2.5 GHz
4x Cortex-A55 @ 2.5 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz ARM Mali-G57
Process 6nm 6nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 108MP, 2x 24MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR4X up to 16 GB
RAM Frequency 2133 MHz 2133 MHz
Storage Type UFS 2.2 eMMC 5.1
UFS 3.1

Display

Resolution 2520 x 1080 2160 x 1080
Display Type Full HD+ @ Refresh Rate 120Hz 4K
Full HD+
QHD+

AnTuTu

Score 410348 317736

Geekbench

Single core 728 656
Multi core 1938 2621

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Ivy V510 5G
4G support LTE Cat-15 DL/Cat-13 UL

Additional Features

AI Yes NPU - 4.8 TOPS
VDSP - VQ7
Charging Fast charging support Fast Charging Support
Bluetooth 5.2 5.0
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6100 Plus Unisoc Tanggula T770