We have analyzed two 8-core mobile processors: MediaTek Dimensity 6100 Plus and Unisoc Tanggula T770. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
Price | ₹99.00 ₹90.00 |
Our Rating | 5.4 7.4 |
Brand | MediaTek Unisoc |
Category | Smartphone Processors Smartphone Processors |
Device Type | Mobile Platform Mobile Platform |
Model | Dimensity 6100 Plus Tanggula T770 |
Announced | July 12, 2023 July 2021 |
CPU |
2x Cortex-A76 @ 2.2 GHz 6x Cortex-A55 @ 2.0 GHz 1x Cortex-A76 @ 2.5 GHz 3x Cortex-A76 @ 2.5 GHz 4x Cortex-A55 @ 2.5 GHz |
GPU | Arm Mali-G57 MP2 @ 950 MHz ARM Mali-G57 |
Process | 6nm 6nm |
Core | 8-core 8-core |
Max Camera Resolution | 1x 108MP, 2x 16MP 1x 108MP, 2x 24MP |
RAM Type | LPDDR4X up to 12 GB LPDDR4X up to 16 GB |
RAM Frequency | 2133 MHz 2133 MHz |
Storage Type |
UFS 2.2
eMMC 5.1 UFS 3.1 |
Resolution | 2520 x 1080 2160 x 1080 |
Display Type |
Full HD+ @ Refresh Rate 120Hz
4K Full HD+ QHD+ |
Score | 410348 317736 |
Single core | 728 656 |
Multi core | 1938 2621 |
5G Support | |
Modem |
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA Ivy V510 5G 4G support LTE Cat-15 DL/Cat-13 UL |
AI |
Yes
NPU - 4.8 TOPS VDSP - VQ7 |
Charging | Fast charging support Fast Charging Support |
Bluetooth | 5.2 5.0 |
Wi-Fi | 5 6 |
NFC | |
GPS | |
FM Radio |