1. Home
  2. Products
  3. Compare
  4. MediaTek Dimensity 6100 Plus vs Unisoc Tanggula T760

MediaTek Dimensity 6100 Plus vs Unisoc Tanggula T760

We have assessed two 8-core mobile processors: MediaTek Dimensity 6100 Plus and Unisoc Tanggula T760. Below, you will discover detailed insights into their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other essential details.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6100 Plus Tanggula T760
Announced July 12, 2023 April 2021

CPU & GPU

CPU 2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
4x Cortex-A76 @ 2.2 GHz
4x Cortex-A55 @ 2.2 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz ARM Mali G57
Process 6nm 6nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 64MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR4X up to 32 GB
RAM Frequency 2133 MHz 2133 MHz
Storage Type UFS 2.2 eMMC 5.1
UFS 3.1

Display

Resolution 2520 x 1080 2160 x 1080
Display Type Full HD+ @ Refresh Rate 120Hz Full HD+ @ 120 FPS

AnTuTu

Score 410348 276292

Geekbench

Single core 728 570
Multi core 1938 2279

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Ivy V510 5G
4G support LTE Cat-15 DL/Cat-13 UL

Additional Features

AI Yes NPU - 2.4 TOPS
VDSP - VQ7
Charging Fast charging support Fast Charging Support
Bluetooth 5.2 5.0
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6100 Plus Unisoc Tanggula T760