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Dimensity 6100 Plus vs Snapdragon 8s Gen 3

In our comparison of two 8-core mobile processors, MediaTek Dimensity 6100 Plus and Qualcomm Snapdragon 8s Gen 3, we provide an in-depth look at their benchmark performance on AnTuTu and Geekbench. Additionally, you will find their technical specifications and other pertinent information to help you understand their capabilities.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6100 Plus Snapdragon 8s Gen 3
SM8650
Announced July 12, 2023 March 18, 2024

CPU & GPU

CPU 2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
1x Cortex-X4 @ 3.0 GHz
4x Cortex-A720 @ 2.8 GHz
3x Cortex-A520 @ 2.0 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz Adreno 700 @ 1100 MHz
Process 6nm 4nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 200MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR5X up to 24 GB
RAM Frequency 2133 MHz 4200 MHz
Storage Type UFS 2.2 UFS 4.0

Display

Resolution 2520 x 1080 3840 x 2160
Display Type Full HD+ @ Refresh Rate 120Hz HDR Vivid, HDR10, HDR10+

AnTuTu

Score 410348 1554839

Geekbench

Single core 728 2019
Multi core 1938 5570

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Snapdragon X70

Additional Features

AI Yes Qualcomm Hexagon NPU
Charging Fast charging support Qualcomm Quick Charge 5 technology
Bluetooth 5.2 5.4
Wi-Fi 5 7
NFC
GPS
FM Radio
  MediaTek Dimensity 6100 Plus Qualcomm Snapdragon 8s Gen 3