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Dimensity 6100 Plus vs Snapdragon 8s Gen 3
In our comparison of two 8-core mobile processors, MediaTek Dimensity 6100 Plus and Qualcomm Snapdragon 8s Gen 3, we provide an in-depth look at their benchmark performance on AnTuTu and Geekbench. Additionally, you will find their technical specifications and other pertinent information to help you understand their capabilities.
General
Device Type
|
Mobile Platform
Mobile Platform
|
Model
|
Dimensity 6100 Plus
Snapdragon 8s Gen 3 SM8650
|
Announced
|
July 12, 2023
March 18, 2024
|
CPU & GPU
CPU
|
2x Cortex-A76 @ 2.2 GHz 6x Cortex-A55 @ 2.0 GHz
1x Cortex-X4 @ 3.0 GHz 4x Cortex-A720 @ 2.8 GHz 3x Cortex-A520 @ 2.0 GHz
|
GPU
|
Arm Mali-G57 MP2 @ 950 MHz
Adreno 700 @ 1100 MHz
|
Process
|
6nm
4nm
|
Core
|
8-core
8-core
|
Camera
Max Camera Resolution
|
1x 108MP, 2x 16MP
1x 200MP
|
RAM & Storage
RAM Type
|
LPDDR4X up to 12 GB
LPDDR5X up to 24 GB
|
RAM Frequency
|
2133 MHz
4200 MHz
|
Storage Type
|
UFS 2.2
UFS 4.0
|
Display
Resolution
|
2520 x 1080
3840 x 2160
|
Display Type
|
Full HD+ @ Refresh Rate 120Hz
HDR Vivid, HDR10, HDR10+
|
Geekbench
Single core
|
728
2019
|
Multi core
|
1938
5570
|
Network
5G Support
|
|
Modem
|
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Snapdragon X70
|
Additional Features
AI
|
Yes
Qualcomm Hexagon NPU
|
Charging
|
Fast charging support
Qualcomm Quick Charge 5 technology
|
Bluetooth
|
5.2
5.4
|
Wi-Fi
|
5
7
|
NFC
|
|
GPS
|
|
FM Radio
|
|