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  4. Dimensity 6100 Plus vs Snapdragon 865 Plus

Dimensity 6100 Plus vs Snapdragon 865 Plus

We have analyzed two 8-core mobile processors: MediaTek Dimensity 6100 Plus and Qualcomm Snapdragon 865 Plus. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6100 Plus Snapdragon 865 Plus
SM8250-AB
Announced July 12, 2023 July 8, 2020

CPU & GPU

CPU 2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
1x Kryo 585 Prime (Cortex-A77) @ 3.1 GHz
3x Kryo 585 Gold (Cortex-A77) @ 2.42 GHz
4x Kryo 585 Silver (Cortex-A55) @ 1.8 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz Adreno 650 @ 670 MHz
Process 6nm 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 200MP, 2x 25MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR5 up to 16 GB
RAM Frequency 2133 MHz 2750 MHz
Storage Type UFS 2.2 UFS 3.0
UFS 3.1

Display

Resolution 2520 x 1080 3840 x 2160
Display Type Full HD+ @ Refresh Rate 120Hz 4K QHD+

AnTuTu

Score 410348 794593

Geekbench

Single core 728 1380
Multi core 1938 3676

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Qualcomm Snapdragon X55

Additional Features

AI Yes Hexagon 698
Charging Fast charging support Quick Charge 4+ technology
Bluetooth 5.2 5.2
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6100 Plus Qualcomm Snapdragon 865 Plus