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Dimensity 6100 Plus vs Snapdragon 7 Gen 3
We have analyzed two 8-core mobile processors: MediaTek Dimensity 6100 Plus and Qualcomm Snapdragon 7 Gen 3. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
General
Device Type
|
Mobile Platform
Mobile Platform
|
Model
|
Dimensity 6100 Plus
Snapdragon 7 Gen 3 SM7550-AB
|
Announced
|
July 12, 2023
November 17, 2023
|
CPU & GPU
CPU
|
2x Cortex-A76 @ 2.2 GHz 6x Cortex-A55 @ 2.0 GHz
1x Cortex-A715 @ 2.63 GHz 3x Cortex-A715 @ 2.4 GHz 4x Cortex-A510 @ 1.8 GHz
|
GPU
|
Arm Mali-G57 MP2 @ 950 MHz
Adreno 720
|
Process
|
6nm
4nm
|
Core
|
8-core
8-core
|
Camera
Max Camera Resolution
|
1x 108MP, 2x 16MP
1x 200MP
|
RAM & Storage
RAM Type
|
LPDDR4X up to 12 GB
LPDDR5 up to 16 GB
|
RAM Frequency
|
2133 MHz
3200 MHz
|
Storage Type
|
UFS 2.2
UFS 3.1
|
Display
Resolution
|
2520 x 1080
3360 x 1600
|
Display Type
|
Full HD+ @ Refresh Rate 120Hz
WFHD+ @ 168 Hz, WQHD+ @ 120 Hz
|
Geekbench
Single core
|
728
1149
|
Multi core
|
1938
3388
|
Network
5G Support
|
|
Modem
|
2G / 3G / 4G / 5G Multi-Mode 4G Carrier Aggregation (CA) 5G Carrier Aggregation (CA), EDGE 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Snapdragon X63
|
Additional Features
AI
|
Yes
Qualcomm Hexagon™ NPU
|
Charging
|
Fast charging support
Qualcomm Quick Charge 5 Technology
|
Bluetooth
|
5.2
5.3
|
Wi-Fi
|
5
6
|
NFC
|
|
GPS
|
|
FM Radio
|
|