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Dimensity 6100 Plus vs Snapdragon 7 Gen 3

We have analyzed two 8-core mobile processors: MediaTek Dimensity 6100 Plus and Qualcomm Snapdragon 7 Gen 3. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6100 Plus Snapdragon 7 Gen 3
SM7550-AB
Announced July 12, 2023 November 17, 2023

CPU & GPU

CPU 2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
1x Cortex-A715 @ 2.63 GHz
3x Cortex-A715 @ 2.4 GHz
4x Cortex-A510 @ 1.8 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz Adreno 720
Process 6nm 4nm
Core 8-core 8-core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 200MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR5 up to 16 GB
RAM Frequency 2133 MHz 3200 MHz
Storage Type UFS 2.2 UFS 3.1

Display

Resolution 2520 x 1080 3360 x 1600
Display Type Full HD+ @ Refresh Rate 120Hz WFHD+ @ 168 Hz, WQHD+ @ 120 Hz

AnTuTu

Score 410348 873939

Geekbench

Single core 728 1149
Multi core 1938 3388

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Snapdragon X63

Additional Features

AI Yes Qualcomm Hexagon™ NPU
Charging Fast charging support Qualcomm Quick Charge 5 Technology
Bluetooth 5.2 5.3
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6100 Plus Qualcomm Snapdragon 7 Gen 3