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  4. MediaTek Dimensity 6100 Plus vs HiSilicon Kirin 990 5G

MediaTek Dimensity 6100 Plus vs HiSilicon Kirin 990 5G

We have analyzed two 8-core mobile processors: MediaTek Dimensity 6100 Plus and HiSilicon Kirin 990 5G. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6100 Plus Kirin 990 5G
Announced July 12, 2023 October 6, 2019

CPU & GPU

CPU 2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
2x Cortex-A76 @ 2.86 GHz
2x Cortex-A76 @ 2.36 GHz
4x Cortex-A55 @ 1.95 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz ARM Mali-G76 MP16 @ 600 MHz
Process 6nm 7nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 64MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR4X up to 12 GB
RAM Frequency 2133 MHz 2133 MHz
Storage Type UFS 2.2 UFS 2.1
UFS 3.0

Display

Resolution 2520 x 1080 3360 x 1440
Display Type Full HD+ @ Refresh Rate 120Hz 4K UHD
Full HD+

AnTuTu

Score 410348 560795

Geekbench

Single core 728 766
Multi core 1938 3061

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Balong 5000 5G modem
4G support LTE Cat. 21

Additional Features

AI Yes HUAWEI Da Vinci Architecture
2x Ascend Lite + 1x Ascend Tiny
HiAI 2.0
Charging Fast charging support Fast Charging Support
Bluetooth 5.2 5.0
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6100 Plus HiSilicon Kirin 990 5G