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MediaTek Dimensity 6100 Plus vs HiSilicon Kirin 9000

We have evaluated two 8-core mobile processors, MediaTek Dimensity 6100 Plus and HiSilicon Kirin 9000. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.

General

Device Type Mobile Platform Mobile Platform
Model Dimensity 6100 Plus Kirin 9000
Announced July 12, 2023 October 22, 2020

CPU & GPU

CPU 2x Cortex-A76 @ 2.2 GHz
6x Cortex-A55 @ 2.0 GHz
1x Cortex-A77 @ 3.13 GHz
3x Cortex-A77 @ 2.54 GHz
4x Cortex-A55 @ 2.05 GHz
GPU Arm Mali-G57 MP2 @ 950 MHz ARM Mali-G78
MP24
Process 6nm 5nm
Core 8-core 8-Core

Camera

Max Camera Resolution 1x 108MP, 2x 16MP 1x 108MP, 2x 32MP

RAM & Storage

RAM Type LPDDR4X up to 12 GB LPDDR5 up to 16 GB
RAM Frequency 2133 MHz 2750 MHz
Storage Type UFS 2.2 UFS 3.1

Display

Resolution 2520 x 1080 4096 × 2160
Display Type Full HD+ @ Refresh Rate 120Hz 4K UHD

AnTuTu

Score 410348 686549

Geekbench

Single core 728 1047
Multi core 1938 3645

Network

5G Support
Modem 2G / 3G / 4G / 5G Multi-Mode
4G Carrier Aggregation (CA)
5G Carrier Aggregation (CA), EDGE
4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Balong 5000 5G Modem
4G support LTE Cat. 24

Additional Features

AI Yes Yes
Charging Fast charging support
Bluetooth 5.2 5.2
Wi-Fi 5 6
NFC
GPS
FM Radio
  MediaTek Dimensity 6100 Plus HiSilicon Kirin 9000