MediaTek Dimensity 6020 vs HiSilicon Kirin 990 5G
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| Price | ₹90.00 ₹90.00 |
| Our Rating | |
| Brand | MediaTek HiSilicon |
| Category | Smartphone Processors Smartphone Processors |
General
| Device Type | Mobile Platform Mobile Platform |
| Model | Dimensity 6020 Kirin 990 5G |
| Announced | March 13, 2023 October 6, 2019 |
CPU & GPU
| CPU |
2x Cortex-A76 @ 2.2 GHz 6x Cortex-A55 @ 2.0 GHz 2x Cortex-A76 @ 2.86 GHz 2x Cortex-A76 @ 2.36 GHz 4x Cortex-A55 @ 1.95 GHz |
| GPU | Arm Mali-G57 MP2 @ 950 MHz ARM Mali-G76 MP16 @ 600 MHz |
| Process | TSMC 7nm 7nm |
| Core | 8-core 8-Core |
Camera
| Max Camera Resolution | 1x 64MP, 2x 16MP 1x 64MP |
RAM & Storage
| RAM Type | LPDDR4X up to 16 GB LPDDR4X up to 12 GB |
| RAM Frequency | 2133MHz 2133 MHz |
| Storage Type |
128GB UFS 2.2 (2-lane) UFS 2.1 UFS 3.0 |
Display
| Resolution | 2520 x 1080 3360 x 1440 |
| Display Type |
Full HD+ IPS LCD display 4K UHD Full HD+ |
AnTuTu
| Score | 354481 560795 |
Geekbench
| Single core | 704 766 |
| Multi core | 1774 3061 |
Network
| 5G Support | |
| Modem |
5G / 4G / 3G / 2G Multi-Mode 5G Carrier Aggregation (CA) 4G Carrier Aggregation (CA) 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM Balong 5000 5G modem 4G support LTE Cat. 21 |
Additional Features
| AI |
MediaTek HyperEngine 3.0
HUAWEI Da Vinci Architecture 2x Ascend Lite + 1x Ascend Tiny HiAI 2.0 |
| Charging | 15W Fast charging Fast Charging Support |
| Bluetooth | 5.1 5.0 |
| Wi-Fi | Wi-Fi 5 (a/b/g/n/ac) 6 |
| NFC | |
| GPS | |
| FM Radio |
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