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HiSilicon Kirin 970 vs Qualcomm Snapdragon 870
We have analyzed two 8-core mobile processors: HiSilicon Kirin 970 and Qualcomm Snapdragon 870. Below, you will find comprehensive details on their performance in benchmark tests such as AnTuTu and Geekbench, as well as their technical specifications and other key features.
General
|
Device Type
|
Mobile Platform
Mobile Platform
|
|
Model
|
Kirin 970
Hi3670
Snapdragon 870
SM8250-AC
|
|
Announced
|
September 1, 2017
January 19, 2021
|
CPU & GPU
|
CPU
|
4x Cortex-A73 @ 2.36 GHz
4x Cortex-A53 @ 1.84 GHz
1x Kryo 585 Prime (Cortex-A77) @ 3.2 GHz
3x Kryo 585 Gold (Cortex-A77) @ 2.42 GHz
4x Kryo 585 Silver (Cortex-A55) @ 1.8 GHz
|
|
GPU
|
Mali G72 MP12 @ 768 MHz
Adreno 650 @ 670 MHz
|
|
Process
|
10nm
7nm
|
|
Core
|
8-core
8-Core
|
Camera
|
Max Camera Resolution
|
1x 48MP, 2x 20MP
1x 200MP, 2x 25MP
|
RAM & Storage
|
RAM Type
|
LPDDR4X up to 8 GB
LPDDR5 up to 16 GB
|
|
RAM Frequency
|
1866 MHz
2750 MHz
|
|
Storage Type
|
UFS 2.1
UFS 3.0
UFS 3.1
|
Display
|
Resolution
|
3840 x 2160
3840 x 2160
|
|
Display Type
|
Full HD
4K
QHD+
|
Geekbench
|
Single core
|
385
1241
|
|
Multi core
|
1365
3417
|
Network
|
5G Support
|
|
|
Modem
|
4G support LTE Cat. 18
Qualcomm Snapdragon X55
|
Additional Features
|
AI
|
Yes
Hexagon 698
|
|
Charging
|
Quick Charge 4+ technology
|
|
Bluetooth
|
4.2
5.2
|
|
Wi-Fi
|
5
6
|
|
NFC
|
|
|
GPS
|
|
|
FM Radio
|
|
