5G is about to come to India. Chipset manufacturers are launching their flagship and mid-range chipsets with 5G support. Recently Huawei launched its Kirin 820 chipset while MediaTek also has its Dimensity 800 chipset that has support for 5G. Both are upper-mid-range chipsets so we decided to compare them.
Here we will compare MediaTek Dimensity 800 vs Kirin 820 Chipsets to know the difference between both chipsets. If you also want to know then read this comparison.
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First of all, looking at the CPU section, here the Kirin 820 and Dimensity 800, both have octa-core CPU based on 64-bit architecture. MediaTek Dimensity 800 integrates 4 ARM Cortex-A76 Big Cores clocked at 2.0GHz and 4 ARM Cortex-A55 Little Cores clocked at 2.0GHz.
While HiSilicon Kirin 820 features 1 ARM Cortex-A76 core clocked at 2.36GHz, 3 ARM Cortex-A76 Cores operating at 2.22GHz, and 4 ARM Cortex-A55 cores clocked at up to 1.84GHz clock speed.
Here the Kirin 820 has a better clock speed of its big cores while Dimensity 800 has a better clock speed of its little cores because of which the Kirin 820 performs better here.
Speaking of GPU, here for gaming the Dimensity 800 has an Arm Mali-G77 MC4 while on the other hand in the Kirin 820 you get an ARM Mali-G57 6-Cores GPU. Here the Mali-G77 present on Dimensity 800 is better than the Mali-G57 of Kirin 820. So the Dimensity 800 offers a better gaming performance than the Kirin 820.
In this section both SoCs are same because both are fabricated on TSMC’s 7nm manufacturing process.
Here the Dimensity 800 has support for up to 32MP + 16MP dual and up to 64MP single camera while the Kirin 820 supports up to 48MP + 24MP dual and up to 64MP single camera. Here the Kirin 820 supports better dual cameras while both support the same single camera.
In this section, the Kirin 820 supports up to 8GB LPDDR4x RAM operating at up to 2133MHz and UFS 2.1, UFS 3.0 based storage while the Dimensity 800 supports up to 10GB LPDDR4x RAM clocked at up to 2133MHz and UFS 2.1 based storage.
Here the Dimensity 800 has support for up to Full HD Plus displays with a maximum resolution of 2520×1080 Pixels while the Kirin 820 also supports Full HD Plus displays with a maximum resolution of 2400 x 1080p.
Speaking of Kirin 820 it has performance uplift of 73% over the previous Kirin 810 due to the use of new 1 big core. While the Dimensity 800 has Quad-core APU 3.0 which can achieve up to 2.5TOPS AI performance.
Connectivity-wise also both chipsets are almost same, both have support for 5G along with 2G, 3G and 4G. Other connectivity features like WiFi, BlueTooth, VoLTE, VoWiFi, GPS, FM Radio, etc. are also included in both SoC.
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Price | ₹99.00 ₹99.00 |
Our Rating | 9.0 6.0 |
Brand | HiSilicon MediaTek |
Category | Smartphone Processors Smartphone Processors |
Device Type | Mobile Platform Mobile Platform |
Model |
Kirin 820
Dimensity 800 MT6873 |
Announced | March 30, 2020 December 26, 2019 |
CPU |
1x Cortex-A76 @ 2.36 GHz 3x Cortex-A76 @ 2.22 GHz 4x Cortex-A55 @ 1.84 GHz 4x Cortex-A76 @ 2.0G Hz 4x Cortex-A55 @ 2.0 GHz |
GPU | ARM Mali-G57 MP6 @ 850 MHz ARM Mali-G57 MP4 @ 650 MHz |
Process | 7nm 7nm |
Core | 8-Core 8-Core |
Max Camera Resolution | 1x 48MP, 2x 20MP 1x 64MP, 2x 16MP |
RAM Type | LPDDR4X up to 12 GB LPDDR4X up to 16 GB |
RAM Frequency | 2133 MHz 2133 MHz |
Storage Type | UFS 2.1 UFS 2.2 |
Resolution | 3360 x 1440 2520 x 1080 |
Display Type | Full HD+ Full HD+ |
Score | 450016 313341 |
Single core | 631 537 |
Multi core | 2429 2170 |
5G Support | |
Modem |
Integrated 5G Modem Balong 5000 4G support LTE Cat. 22 Integrated 5G Modem 4G support LTE Cat. 18 |
AI | Da Vinci NPU MediaTek APU 3.0 |
Charging | - |
Bluetooth | 5.1 5.1 |
Wi-Fi | 6 5 |
NFC | |
GPS | |
FM Radio |