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HiSilicon Kirin 710 vs Qualcomm Snapdragon 870
We have evaluated two 8-core mobile processors, HiSilicon Kirin 710 and Qualcomm Snapdragon 870. Below, you will find a detailed comparison of their performance in benchmark tests like AnTuTu and Geekbench, along with their technical specifications and additional relevant information.
General
Device Type
|
Mobile Platform
Mobile Platform
|
Model
|
Kirin 710 Hi6260
Snapdragon 870 SM8250-AC
|
Announced
|
July 19, 2018
January 19, 2021
|
CPU & GPU
CPU
|
4x Cortex-A73 @ 2.2 GHz 4x Cortex-A53 @ 1.7 GHz
1x Kryo 585 Prime (Cortex-A77) @ 3.2 GHz 3x Kryo 585 Gold (Cortex-A77) @ 2.42 GHz 4x Kryo 585 Silver (Cortex-A55) @ 1.8 GHz
|
GPU
|
Mali-G51 MP4 @ 1000 MHz
Adreno 650 @ 670 MHz
|
Process
|
12nm
7nm
|
Core
|
8-core
8-Core
|
Camera
Max Camera Resolution
|
1x 40MP, 2x 24MP
1x 200MP, 2x 25MP
|
RAM & Storage
RAM Type
|
LPDDR4 up 6 GB
LPDDR5 up to 16 GB
|
RAM Frequency
|
1866 MHz
2750 MHz
|
Storage Type
|
eMMC 5.1 UFS 2.1
UFS 3.0 UFS 3.1
|
Display
Resolution
|
2340 x 1080
3840 x 2160
|
Display Type
|
Full HD
4K QHD+
|
Geekbench
Single core
|
390
1241
|
Multi core
|
1393
3417
|
Network
5G Support
|
|
Modem
|
4G support LTE Cat. 12
Qualcomm Snapdragon X55
|
Additional Features
AI
|
No
Hexagon 698
|
Charging
|
Quick Charge 4+ technology
|
Bluetooth
|
4.2
5.2
|
Wi-Fi
|
4
6
|
NFC
|
|
GPS
|
|
FM Radio
|
|